High Vacuum φ8inch Sputtering Machine
We can form films under high vacuum conditions because we use load lock-type apparatus.
We can supply uniform films through the use of φ300mm targets.
We are able to support substrate heating temperatures up to 600℃.
This process is ideal for forming precious metal electrode films in high dielectric and ferroelectric devices as well as various memory wiring materials.
|size of cathode||φ300×2（RF+DC）|
|size of substrate (MAX)||〜φ8in.x4 (load-lock type)|
|Sub. Temperature (MAX)||600℃|
|Exhaust system||RP, TP|
|Power of Depo (MAX)||DC2000W X 2, RF2000W|
|Back Pressure (MAX)||8.0×10－6Pa|
|Sputtering Targets||Pt, Ru, Al, Cr, Ta, Ti|
- *We are flexible to sputter materials, which are not on our target list. Please contact our sales representatives for detail.