Interback Sputtering Machine
We can form films on large substrates such as φ300Si wafers and glass for FPD.
|size of cathode||5inch × 30inch|
|size of substrate (MAX)||〜370㎜×470㎜|
|Sub. Temperature (MAX)||250℃|
|Exhaust system||RP, CP|
|Power of Depo (MAX)||DC1500W X2|
|Back Pressure (MAX)||5.0×10－5Pa|
|Sputtering Targets||Cr, Cu, Mo,Ta, Ti, ITO, IZO, Ag, APC-TR,
- *We are flexible to sputter materials, which are not on our target list. Please contact our sales representatives for detail.
- *Thickness and temperature uniformity in plane is ± 10%. There are some exceptions for some materials and sputter conditions.