Thin FilmHow sputtering targets are made

Enabling technological innovation Advanced Thin-Film Materials

Nanometer-scale thin films that determine device performance

Thin films used in products such as hard disk drives are an essential technology supporting today's information-driven society. Furuya Metal's sputtering targets enable the formation of highly uniform thin films at the atomic level, contributing to higher recording densities for data centers and other advanced information technologies.

Used in hard disk drives
for data centers

Furuya Metal Sputtering Targets Materials used to form nanometer-scale thin films for electronic devices and other applications.

Our Customers Used for hard disk drive media

01

Sponge Refining

Producing high-purity sponge metal in-house

Ruthenium contains impurities when it is first extracted from ore. At Furuya Metal, this ruthenium is refined in-house into high-purity sponge metal.

02

Blending

The way materials are blended affects performance

Ruthenium is blended with other metals, such as cobalt, according to product requirements. The composition has a significant impact on the performance of the sputtering target.

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What is sputtering?

Sputtering is one of the most widely used techniques for forming thin films. In this process, ions are accelerated toward a material in a vacuum, causing atoms and molecules to be ejected and deposited as a thin film on a substrate.

Sputtering is essential to the manufacture of semiconductors and electronic components because it can form highly uniform and precise films. At Furuya Metal, precious metal sputtering targets are manufactured for use in high-performance thin-film applications.

03

Sintering

Powder consolidation without melting

Ruthenium is extremely difficult to melt. To form the target, Furuya Metal uses SPS (Spark Plasma Sintering), a process that rapidly consolidates powder under high temperature and pressure.

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What is a spark plasma sintering system?

A spark plasma sintering (SPS) system is a piece of equipment that applies pressure while passing an electric current through metal powders, consolidating them into a dense solid.

Compared with conventional sintering methods, SPS significantly reduces processing time and minimizes contamination, enabling the efficient production of high-purity, high-strength materials.

At Furuya Metal, SPS is used in the manufacture of high-performance materials, including thermocouples and sputtering targets.

04

Cutting, Machining, and Finishing

Removing impurities and shaping the final product

The cutting process is an important step in which metal materials are precisely machined to the shapes and dimensions required for each application. More than simply adjusting size, this process controls flatness and thickness at the micron level to help prevent film non-uniformity and particle generation during thin-film deposition.

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Furuya Metal’s mirror finishing technology

In advanced materials, even the smallest surface irregularities can affect performance. Furuya Metal’s mirror finishing technology achieves nanometer-level smoothness and uniformity and is used for sputtering targets, thermocouple components, and other products that require a high degree of precision.

Surface precision at the nanometer level has a significant impact on product reliability and service life.

05

Inspection, Cleaning, and Packaging

The final three steps determine product quality

During inspection, dimensions and surface conditions are checked, and products are examined for defects and contamination. The cleaning process that follows removes fine particles and residual oils to achieve the level of cleanliness required for semiconductor manufacturing.

Finally, the products are sealed in specialized packaging to prevent contamination before shipment.

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Particle-free quality for sputtering targets

Furuya Metal’s sputtering targets are produced with high purity, high density, and uniform composition. Particle control is also a critical aspect of quality.

In semiconductor manufacturing, argon ions collide with a sputtering target, causing atoms to be ejected and deposited onto a substrate to form a thin film. If particles are present, they can be incorporated into the film, leading to defects and reduced yield.

Furuya Metal minimizes particle contamination to meet the demanding quality requirements of semiconductor manufacturing and improve production efficiency.

06

Finished Product

Essential target materials for advanced electronics manufacturing

Sputtering targets are essential materials used to form thin films in semiconductors, displays, smartphones, and other advanced electronics products. Furuya Metal provides high-purity, high-density targets for applications where thin-film quality and performance are critical.

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Aluminum scandium for next-generation technologies

Aluminum scandium (Al–Sc) targets are used primarily in 5G mobile devices and play an important role in the performance of 5G communications. Looking ahead, demand is expected to grow with the adoption of autonomous driving technologies and the development of 6G.

To meet this demand, Furuya Metal is working to ensure a stable supply of Al–Sc materials and establish mass-production capabilities.